5W Desk Style Package Material Applied UV Laser Marking Machine
Applied materials:
Brittleness material like fire-proof material, glass, ceramics, monocrystalline silicon and polycrystalline silicon etc. Special material like small Flexible Printed Circuit etc
Applied Industries: It can be applied for precision marking, micro-processing and cold processing in micro-electronics industry. Marking, scribing, carving, cutting and surface processing on various type of chips, flexible printed circuit board, ultra-thin glass, LCD screen, textile, sheet ceramic, semiconductor wafer, IC grain, sapphire, polymeric film, brittleness material and Special plastic packaging etc.
Product Description
The UV laser marking machine is widely used for super fine marking and engraving, can mark on the surface of all kinds of regular glass and crystal, especially suitable for food and pharmaceutical packaging marking and microporous, high-speed division of glass materials and cutting of complex pattern for silicon wafer and some other areas.
UV laser marking machine is developed by using a 355nm UV laser, it adopts third-order cavity frequency multiplication technology. Compared to infrared laser, the focusing spot of UV laser is much smaller, which helps to reduce the mechanical deformation of the materials to a large extent. It features of smaller heat affected area and more beautiful marking effect.
Features:
1. Adopt high quality UV laser source, wave length is 355nm
2. Compare with normal laser marking machine, the focused spot of UV laser is smaller and marking result is better precision. It has incomparable advantage than other laser machines for applied precision marking, precision cutting and micro processing on the special materials.
3. It suitable for precision micro machining, cold processing. Compare with infrared diode pumped machine, it has higher absorption rate of metal, monocrystalline silicon, polycrystalline silicon, industrial ceramics, glass etc, can used for marking, cutting, scribing and cutting for small Flexible Printed Circuit.
Parameter:
| Laser Medium |
ND:YVO4 |
| Laser Wavelength |
355nm |
| Average Output Power |
≥5W@30KHZ |
| Peak Power: |
≥10KW |
| Marking Range (mm) |
100×100(can be enlarged at 160×160, 250x250 or 300x300 optional) |
| Marking Speed |
15000mm/S |
| Maintenance |
Free |
| Repeat Accuracy |
±0.01mm |
| Cooling System |
Water cooler |
| Main Machine Dimension(mm) |
530X430X710 |
| Weight of Whole Machine |
60KG |
| Power Supply |
220V±22V/single phase/ 50Hz /10A |
| Overall Power Consumption |
200W |
| Control System Dimension |
Integration |
Product Tags:
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Laser Metal Marking Machine , Stainless Steel Laser Engraving Machine Images
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